SMT Equipment: SIEMENS High Speed SMT Machine

SIEMENS HS50 Placement Accuracy:±90um,4sigma;±67.5um,3sigma Board Dimension: 50*50mm~368*460mm High Precision:±0.09MM Cycle Time: 0.072 sec/chip

SIEMENS F5 Board Dimension: 50*50mm~368*460mm High Precision: ±0.06MM Cycle Time: 0.423 Sec/chip,2 Sec/chip

JUKI 750 High Precision: ±0.1MM/CHIP, ±0.09MM/QFP Board Dimension: 50*30mm~250*330mm Cycle Time: 0.25 sec/chip

JUKI 760 High Precision: ±0.1MM/CHIP, ±0.04MM/QFP Board Dimension: 50*30mm~250*330mm Cycle Time: 0.32 sec/chip

J UKI 760 Max Routing Speed:100 mm /S Spindle Speed: 5000~50000rpm Repeatability: <0.1 mm Two workstations,one routung head alternate use Noise Level:<75dBa Resolution:+-0.02 mm Microsoft Windows XP PCB Panel Size: Thickness: 0.4 mm x 2 mm Max: 350 mm x 350 mm

SMT Equipment: Juki SMT Machine

SJ50 Travel: 590mm*490mmor490mm*490mm Velocity(x,y):1500mm/Sec Encoder Resolution:1um

Inspection Item: BGA Shift BGA Short Cold Solder Solder Void