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COG/COF/FOG

COG Automatic Bonding Machine

  • LCD Size: 40L×30W～165LX120W
  • Chip Max size: 30L×5W mm
  • Chip Kind: 2 Type
  • Placement Accuracy(3σ): ±5.0μm
  • Pin Pitch to 38μm

COG/COF/FOG Automatic Bonding Machine

  • LCD Size: 27L×27W～130LX130W
  • FPC Size: 27L×27W～110LX130W
  • Chip Max Size: 30L×5W mm
  • Chip Kind: 2 Type
  • Placement Accuracy(3σ): ±5.0μm
  • Pin Pitch Fine to 38μm


 


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  Suites 1506-1508, One Exchange Square, 8 Connaught Place Central ,Hong Kong.
Telephone: (852) 2341-0273 Facsimile: (852) 2263-1223		 Gushu Industrial Estate, Xixiang, Baoan, Shenzhen, PRC .
Telephone: 0755-27495818, 33886666
Facsimile :0755-27494014