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COG/COF/FOG

COG Automatic Bonding Machine

  • LCD Size: 40L×30W～165LX120W
  • Chip Max size: 30L×5W mm
  • Chip Kind: 2 Type
  • Placement Accuracy(3σ): ±5.0μm
  • Pin Pitch to 38μm

COG/COF/FOG Automatic Bonding Machine

  • LCD Size: 27L×27W～130LX130W
  • FPC Size: 27L×27W～110LX130W
  • Chip Max Size: 30L×5W mm
  • Chip Kind: 2 Type
  • Placement Accuracy(3σ): ±5.0μm
  • Pin Pitch Fine to 38μm


 


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  Unit 5811-12,58/F,The Center 99 Queen's Road Central,Central Hong Kong
Telephone:(852)2341-0273
Facsimile:(852)2263-1223