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Production
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ZASTRON >> Production Technology


FPC Technology


Description
2007
2008
2009
2010
Layers
Max.  Layer Count
S/S & D/S
S/S & D/S
S/S & D/S
Multi-Layer(WuXi)
S/S & D/S
Multi-Layer(WuXi)
Finished thickness
(CVL/PI  or FR4)
0.165 ~ 0.460 mm
0.165 ~ 0.652 mm
0.165 ~ 0.652 mm
0.165 ~ 0.652 mm
LW/LS
Layer
60/60μm
(Cu 12 μm)
50/50μm
(Cu 12 μm)
40/40μm
(Cu 12 μm)
40/40μm
(Cu 12 μm)
Board Dimension  
Max. Finished Panel size
250x400mm
250x400mm
250x400mm
250x400mm
Finished Board Thickness Tolerance
+/- 10%
+/- 10%
+/- 10%
+/- 10%

Description
2007
2008
2009
2010
FCCL
PI Dielectric  Thickness(Min)
12.5 μm
12.5 μm
12.5 μm
12.5 μm
PI Dielectric  Thickness(Max)
50 μm
50 μm
50 μm
50 μm
Mechanical Drilling
Min. Drill Size for TH
200 μm
150 μm
150 μm
150 μm
Hole Diameter Tolerance(PTH)
+/- 0.05mm
+/- 0.038mm
+/- 0.038mm
+/- 0.038mm
PAD SIZE
D+0.2mm
D+0.15mm
D+0.15mm
D+0.15mm

Description
2007
2008
2009
2010
Tolerance After Etching
+/- 20%
+/- 15%
+/- 15%
+/- 15%
Legend  Mask Print
Registration (Min)
+/- 0.15mm
 +/- 0.1mm
 +/- 0.1mm
 +/- 0.1mm
Coverlay
Registration

Photo image
(UV Type)
+/- 0.05mm
(Green)
+/- 0.0375mm
(Green&Yellow)
+/- 0.0375mm
(Green&Yellow)
+/- 0.025mm
(Green&Yellow)
Solder maskThickness
on Finger or Pad
8~25 μm
8~25 μm
8~25 μm
8~25 μm
Film type(CL)
+/- 0.2mm
+/-0.15mm
+/-0.15mm
+/-0.15mm

Description
2007
2008
2009
2010
(Hard Tooling)
Punching Hole Diameter(Min)
Space(Min)  Tolerance
0.3mm
0.15mm
±0.1mm
0.2mm
0.15mm
±0.05mm
0.2mm
0.15mm
±0.05mm
0.2mm
0.15mm
±0.05mm
(Soft Tooling)
Punching Hole Diameter(Min)
Space(Min)  Tolerance
1.0mm
0.8mm
±0.2mm
1.0mm
0.8mm
±0.15mm
1.0mm
0.8mm
±0.15mm
1.0mm
0.8mm
±0.15mm
Plating Gold(Soft)
Ni=1.0 ~ 9μm;    Au=0.05-0.20μm


 


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